ICP Etching - 300

Product Overview

Overview of ICP Technology
Inductively Coupled Plasma (ICP) is an advanced dry etching technology widely applied in semiconductor manufacturing, microelectronic device processing, and Micro-Electro-Mechanical Systems (MEMS). Compared to conventional Reactive Ion Etching (RIE), ICP offers higher plasma density, lower ion energy, and enhanced etching rates, making it ideal for high-precision etching processes.

Features

1.Plasma GenerationPlasma

• ICP systems use RF (Radio Frequency) power through an inductive coil to generate high-density plasma in a vacuum chamber.o
• The alternating electromagnetic field ionizes gas molecules to produce a high-density plasma (10¹¹10¹² cm³).o
• Unlike RIE, ICP decouples ion density from ion energy, allowing independent control of these parameters.

2.Ion Bombardment and Chemical ReactionIon

• High-density plasma ensures uniform etching, with ion energy being precisely controlled.o
• Etching gases dissociate in the plasma to form reactive free radicals, which chemically react with the substrate surface.o
• Low-energy ion bombardment aids in removing volatile byproducts.

3.Independent Contro

• ICP systems typically feature two RF power supplies:
• Coil Power (ICP Power): Controls plasma density.
• Substrate Bias Power: Controls ion energy and directionality.

Applications

ICP Applications
1. Semiconductor Manufacturing

• High Aspect Ratio Silicon Vias (TSV)
  
• FinFET, CMOS, and advanced device fabrication
  
• 3D integrated circuit technology

2. Micro-Electro-Mechanical Systems (MEMS)

• Micro-sensors (e.g., pressure, accelerometers)
  Micro-actuators
  Silicon-based microstructure manufacturing

3. Optoelectronic Devices

• Optical waveguide components
  Laser device fabrication
  Optical thin-film production

4. Nanotechnology

• Nano-pore array etching
  High-density storage devices
  Nano-photonics devices

5. Advanced Packaging Technology

• Wafer-Level Packaging (WLP)
  High-density interconnect technology

6. Research Field

• Micro-nano structure studies
  Material surface processing
  Optimization of microelectronics processe