ICP Etching – 300 Inductively Coupled Plasma Etching System

Product Overview

Overview of ICP Technology
Inductively Coupled Plasma (ICP) is an advanced dry etching technology widely applied in semiconductor manufacturing, microelectronic device processing, and Micro-Electro-Mechanical Systems (MEMS). Compared to conventional Reactive Ion Etching (RIE), ICP offers higher plasma density, lower ion energy, and enhanced etching rates, making it ideal for high-precision etching processes.

Features

1.Plasma GenerationPlasma

• ICP systems use RF (Radio Frequency) power through an inductive coil to generate high-density plasma in a vacuum chamber.o
• The alternating electromagnetic field ionizes gas molecules to produce a high-density plasma (10¹¹10¹² cm³).o
• Unlike RIE, ICP decouples ion density from ion energy, allowing independent control of these parameters.

2.Ion Bombardment and Chemical ReactionIon

• High-density plasma ensures uniform etching, with ion energy being precisely controlled.o
• Etching gases dissociate in the plasma to form reactive free radicals, which chemically react with the substrate surface.o
• Low-energy ion bombardment aids in removing volatile byproducts.

3.Independent Contro

• ICP systems typically feature two RF power supplies:
• Coil Power (ICP Power): Controls plasma density.
• Substrate Bias Power: Controls ion energy and directionality.

Applications

ICP Applications
1. Semiconductor Manufacturing

• High Aspect Ratio Silicon Vias (TSV)
  
• FinFET, CMOS, and advanced device fabrication
  
• 3D integrated circuit technology

2. Micro-Electro-Mechanical Systems (MEMS)

• Micro-sensors (e.g., pressure, accelerometers)
  Micro-actuators
  Silicon-based microstructure manufacturing

3. Optoelectronic Devices

• Optical waveguide components
  Laser device fabrication
  Optical thin-film production

4. Nanotechnology

• Nano-pore array etching
  High-density storage devices
  Nano-photonics devices

5. Advanced Packaging Technology

• Wafer-Level Packaging (WLP)
  High-density interconnect technology

6. Research Field

• Micro-nano structure studies
  Material surface processing
  Optimization of microelectronics processe