PVD Thin Film Deposition System（SVAC-FilmLab-G）

Product Overview

Physical vapor deposition (PVD) technology refers to the gasification of the surface of a material source (solid or liquid) into gaseous atoms or molecules, or partial ionization into ions, and through a low-pressure gas (or plasma) process. Physical vapor deposition is one of the main surface treatment technologies for depositing thin films with certain special functions on the surface of the substratePhysical vapor deposition (PVD) technology refers to the gasification of the surface of a material source (solid or liquid) into gaseous atoms or molecules, or partial ionization into ions, and through a low-pressure gas (or plasma) process. Physical vapor deposition is one of the main surface treatment technologies for depositing thin films with certain special functions on the surface of the substrate

Technical characteristics

Automatic control of deposition rate; It can integrate front-end and back-end equipment such as efficiency testing and spin coating