EtchLab - 300 (RIE Etching)

Product Overview

Overview of RIE Process
Reactive Ion Etching (RIE) is a dry etching technology widely used in semiconductor manufacturing, microelectronic device processing, and Micro-Electro-Mechanical Systems (MEMS). It combines physical etching (ion bombardment) and chemical etching (chemical reactions), enabling high-precision, highly anisotropic pattern transfer onto substrates.

Features

1.Physical Etching (Ion Bombardment)

• In a low-pressure plasma environment, an electric field accelerates ions to bombard the substrate surface vertically.n a low-pressure plasma environment, an electric field accelerates ions to bombard the substrate surface vertically.o
• The kinetic energy of the ions disrupts the surface material structure, causing surface atoms to detach.o
• Physical etching is highly directional, achieving high anisotropy.

2.Chemical EtchingChemical Etching

• Etching gases (e.g., SF, CF, Cl, O) are dissociated in the plasma, generating highly reactive free radicals.Etching gases (e.g., SF, CF, Cl, O) are dissociated in the plasma, generating highly reactive free radicals.o
• These radicals chemically react with the surface atoms of the substrate to form volatile byproducts, which are removed by the vacuum system.

3.Synergy of Physical and Chemical Etching

• Chemical reactions enhance etching selectivity and rate.Chemical reactions enhance etching selectivity and rate.o
• Ion bombardment ensures etching directionality.

Applications

ICP Applications
1. Semiconductor Manufacturing

• High Aspect Ratio Silicon Vias (TSV)
  
• FinFET, CMOS, and advanced device fabrication
  
• 3D integrated circuit technology

2. Micro-Electro-Mechanical Systems (MEMS)

• Micro-sensors (e.g., pressure, accelerometers)
  Micro-actuators
  Silicon-based microstructure manufacturi

Applications

Applications of RIE

1.Semiconductor Manufacturing

• Integrated Circuit (IC) processing
  
• MOSFET and CMOS fabrication
  
• Through-Silicon Via (TSV) creation

2. Micro-Electro-Mechanical Systems (MEMS)

• Micro sensors (e.g., accelerometers, pressure sensors)
  
• Micro actuators

3. Optoelectronic Devices

• Laser devices
  
• Optical waveguide components

4. Nanotechnology

• Nano-structure fabrication
  
• High-density data storage devices

5. Flat-Panel Displays (FPD)

• LCD and OLED manufacturin
• Thin-film transistor (TFT) etching

6. Research Fields

• Microstructure and material surface processing
• Nanoscale studies