Chemical Mechanical Polisher - xCMP150 Model

Product Overview

In view of the processing requirements for high surface quality and high flatness of wafers in chip research and development, especially the third- and fourth-generation semiconductor wafers represented by SiC and metal diamond, the equipment can effectively control the flatness of the wafer and the uniformity of the film through the master-slave collaborative partition pressurization. 

Basic Information

• Basic configuration
  
• Polishing head module: air film pressurization, 6 zones independently controlled
  
• Friction Module: Characterizes friction using motor current
  
• Sample processing capacity: 2/4/6 inches
  
• Polishing implementation: touch screen program control
  
• Polishing head downforce: 0~4 psi (4 inches).
  
• Polishing head speed: 0~300 rpm, continuous controllable
  
• Polishing disc speed: 0~300 rpm, continuous controllable
  
• Dresser speed: 0~300 rpm, continuous controllable
  
• Polishing head/dresser reciprocating: stroke 90 mm, continuous and controllable speed
  
• Polishing slurry: 1 channel, peristaltic pump supply, flow rate0~300 mL/min
  
• Deionized water: 1 channel, peristaltic pump supply, flow rate0~300 mL/min
  
• Upgrade the configuration
  
• Electrochemistry Module: Potential range ± 10 V, current range ± 250 mA, supports three-electrode and two-electrode systems, and supports a variety of measurement methods, such as cyclic voltammetry.
  
• Ultraviolet optical module: 200-400 nm ultraviolet light source (can be customized), power 0-500W (can be customized).

Application Direction

• Polishing slurry
  
• Polishing pad
  
• Polishing processing
  
• Polishing equipment
  
• Customized service

Technical characteristics

Standard 4 inch bald head

Strong structural replaceability:

Can be used with standard 4 inch polishing head 60% polishing package.  
Proprietary air film processing technology, which can be customized according to sample requirements.

Multi-gas channel:

• 3-8 gas paths, which can be configured according to the sample processing technology

150 Universal Connection Flange - Various Load Types:

• The flange design of the unique structure "two-point bead positioning" is used. Accurate positioning, easy to disassemble and assemble.
  
• Independent air pressure control of the holding ring/sample, which can realize multi-stage pressure.