The Profilm3D® and Profilm3D-200 optical profilometers are affordable, non-contact, white light interferometry-based (WLI) 3D surface topography measurement systems. The latest generation of the white light interferometer includes new imaging modes that extend performance and value. The Profilm3D series measures nanometer- to millimeter-scale surface with a simple, flexible recipe setup, accommodating single scans or automated measurements on multiple sites to support both R&D and production environments.
"The Filmetrics Profilm3D and Filmetrics Profilm3D-200 white light interferometers generate high-resolution measurements of the surface topography with sub-nanometer-level resolution. The tools support both vertical scanning and phase shifting interferometry. Using TotalFocus® technology, Profilm3D provides stunning 3D natural color images with every pixel in focus. The latest generation of the Profilm3D white light interferometer introduces Enhanced Roughness imaging for measuring rougher surfaces, higher slopes and lower reflectivity surfaces.
In the Profilm3D measurement technique, the vertical resolution of the measurement is independent of the numerical aperture of the objective, enabling high-resolution measurements with a large field of view. The measured area can be further increased by stitching multiple fields of view into a single measurement. The Profilm3D optical profilometer also features a simple, innovative user interface and automated features to support a broad range of working environments, from R&D to production.
Our Profilm® software suite features cutting-edge cloud-based ProfilmOnline® web services, Android and iOS mobile applications, and advanced Profilm desktop software to provide flexible data storage, visualization and analysis solutions."
• Vertical scanning and phase shifting interferometry for measurement of surface features from nanometers to millimeters
• TotalFocus 3D imaging with optimized focus for each pixel through the full measured range
'• True-Color imaging produces the actual sample colors for enhanced visualization, especially for subtle or buried features
• Enhanced Roughness Mode (ERM) increases fringe contrast for improved fidelity on sloped surfaces such as lenses and enables signal improvement for rough surfaces
• Automated focus with industry-leading long piezo travel range for scanning multiple surfaces separated by large height distances
'• Automated X-Y stage with a long travel range, great for mapping and stitching scans
'• B7Intuitive software suite including advanced Profilm desktop, the cloud-based ProfilmOnline and mobile applications for flexible data storage, visualization and analysis
The Filmetrics Profilm3D series white light interferometry-based profilometers support non-contact measurement of 3D step heights from nanometer to millimeter scales. Vertical scanning interferometry can measure a large step height with nanometer-level resolution. Sub-nanometer-level features can be measured rapidly using phase-shifting interferometry. Z-stitching interferometry enables rapid measurement of very large steps with multiple high-resolution scans that are combined into a single measurement. This variety of techniques enables users to quantify the amount of material removed or deposited by semiconductor processes such as etch, sputter, deposition, spin coating and more.
The Filmetrics Profilm3D series optical profilers provide non-contact measurements of 3D texture, quantifying the samples roughness and waviness. Phase-shifting mode is ideal for very smooth surfaces. Software filters separate the measurement into roughness and waviness components and calculate parameters such as root mean square (RMS) roughness.
The Filmetrics Profilm3D series white light interferometry-based profilometers support non-contact measurement of 3D step heights from nanometer to millimeter scales. Vertical scanning interferometry can measure a large step height with nanometer-level resolution. Sub-nanometer-level features can be measured rapidly using phase-shifting interferometry. Z-stitching interferometry enables rapid measurement of very large steps with multiple high-resolution scans that are combined into a single measurement. This variety of techniques enables users to quantify the amount of material removed or deposited by semiconductor processes such as etch, sputter, deposition, spin coating and more.
The Filmetrics Profilm3D series optical profilometers with TotalFocus capture True Color 3D images with every pixel in focus. This feature can be used to distinguish boundaries between materials with different optical properties.
The Filmetrics Profilm3D white light interferometer features motorized X-Y and Z stages with 100mm travel and a manual tip/tilt stage. The system supports phase shifting and vertical scanning interferometry for high-resolution 3D surface topography measurements.
The Filmetrics Profilm3D-200 white light interferometer includes the same features as the Profilm3D but adds a larger motorized X-Y stage supporting 200mm by 200mm of travel.
The Filmetrics Profilm software package is comprehensive, intuitive, fast and user-friendly. 3D data operations and analysis functions such as leveling, filtering, step height, roughness, and surface topography analysis techniques are included in the basic configuration. Profilm supports ISO roughness calculation methods, plus local standards, such as ASME. Data from Profilm can be uploaded to the ProfilmOnline platform with a single click for easy, secure data storage and sharing.
Filmetrics ProfilmOnline is a cloud-based 3D data visualization and analysis platform developed as part of the Profilm software suite. ProfilmOnline is the place to share, store, view and analyze 3D data, whether youre on your computer or a mobile device. Apps for Android and iOS operating systems are available and a wide variety of file formats is supported. Data can be encrypted for security.
The four-position turret holds objective lenses with magnifications ranging from 5X to 100X, to support nano-, micro- and macro-topography applications. The 5X objective is a Michelson interferometry objective. The 10X, 20X, 50X, and 100X objectives are Mirau interferometry objectives.
Motorized stages for the X-Y and Z axes are standard on the Profilm3D system. The X-Y stage has a travel of 100mm by 100mm for Profilm3D, and 200mm by 200mm for Profilm3D-200. The Z stage has a range of 100mm. The travel along all axes of motion is programmable. A manual tip and tilt stage are standard with ±5° of motion.
A manual R-theta wafer stage is also available on Profilm3D series optical profilometers, supporting 50mm- to 200mm-diameter wafers. In addition, the Profilm3D-200 supports an adapter for holding up to 200mm wafers.
The Filmetrics Profilm3D series offers Accurion Nano30 Series active tabletop vibration isolation systems, which use electro-dynamic drive active vibration isolation in all six degrees of freedom.
he Filmetrics Profilm3D series includes a custom-designed Cr on Si 10µm step height standard, consisting of an etched step with a chrome coating. A multi-step height standard is also available as an option, featuring 0.1µm, 2µm and 4µm steps.
1. Universities, research labs and institutes
2. Silicon and compound semiconductor
3. Precision optics and mechanics
4. Medical devices
5. LED: Light emitting diodes
6. Power devices
7. MEMS: Micro-electromechanical systems
8. Data storage
9. Automotive
10. And more: Contact us with your
The Profilm3D easily measures this silkscreen print on machined stainless steel. Measure thickness and uniformity of the printing layer and characterize delamination, coverage uniformity and surface roughness. The Profilm3D design offers easy sample setup and software interface to streamline manufacturing and QC process monitoring.
The Profilm3D can be used in metal finishing and tooling, such as for the critical calibration of a dicing saw where cut depths into a piezoelectric material are quantified. The system also simultaneously measures surface roughness and critical dimensions of machined components.
Backend packaging bump coplanarity is critical to ensure optimized bonding, and the Profilm3D quickly generates measurements of coplanarity, pitch uniformity, size, and more. Other applications include mask manufacturing, laser marking, photoresist patterning, and other R&D and process qualification.
This scan shows a miniaturized Fresnel lens that was created by electron beam lithography. For steep surfaces such as lenses, the Profilm3D in Enhanced Roughness mode can now measure up to 60° of slope.
The Profilm3D is well suited to measurement of biological samples, such as this Tetraphenylprophyrin (TPP) thin film on glass. The TPP was imaged with the 50X Mirau objective at 2X zoom, and the film displays growth of crystalline structures. This image was generated with TotalFocus® color technology, showing the actual colors of the sample.