SUME BW510 Series (Wafer Bonding System)

Basic Information

SUME BW510 is a semi-automatic wafer bonding equipment used for R&D or small batch production. It has good pressure and temperature uniformity. The unique structural design ensures that the bonding pressure plate is relatively horizontal. The advanced vacuum system and cavity design are convenient. Simple menu editing and device status monitoring as well as security protection functions. SUME BW510 is compatible with most wafer sizes, open chamber design, easy maintenance, and conversion of different specifications, small footprint, and complete functions.

To provide customers with a complete set of solutions such as wafer alignment, wafer bonding, measurement and inspection, and process control, and fully serve customers' R&D and mass production needs

Applicationaspect

SUME BW510 is a highly flexible bonding equipment that can handle single chips up to 200mm wafer size. The equipment supports common wafer bonding processes such as eutectic bonding, metal bonding, adhesive bonding, direct bonding and other process requirements. The easy-to-use bonding chamber design allows for quick tooling replace ment to facilitate reprocessing of other size processes in less than 5 minutes. It is very suitable for small-batch production in laboratories, research institutes or companies. The menu can be directly copied to other bonding equipment to facilitate expanded production.

Advantage

The SUME BW510 has more functions and better effects than similar bonding equipment. Coupled with the equipment's friendly ergonomics and user interaction system, it makes production faster and more convenient, making product yields higher and more efficient. It reduces maintenance costs and makes maintenance more efficient, making it the
first choice for scientific research units and small batch production targets.

Highlights

• High vacuum bonding cavity;
  
• Faster heating and vacuuming to increase productivity
  
• Can produce single chip to 200mm products;
  
• Compatible with experimentation and production；
  
• High degree of program automation;
  
• Better cost control.